Special Issue on Mechanical Engineering and Applications on Semiconductor Industry

Submission Deadline: Feb. 20, 2020

This special issue currently is open for paper submission and guest editor application.

Please download to know all details of the Special Issue

Special Issue Flyer (PDF)

  • Special Issue Editor
    • Jinfeng Wang
      Engineering, Cabot Microelectronics, Aurora, USA
    Guest Editors play a significant role in a special issue. They maintain the quality of published research and enhance the special issue’s impact. If you would like to be a Guest Editor or recommend a colleague as a Guest Editor of this special issue, please Click here to fulfill the Guest Editor application.
    • Wei Fan
      Engineering, Cabot Microelectronics, Aurora, USA
    • Wei Wei
      Engineering, Cabot Microelectronics, Aurora, USA
    • Phil Fraundorf
      Physics, University of Missouri, St. Louis, USA
    • Wentao Qin
      R&D, On Semiconductor, Phoenix, USA
    • Qinmin Yang
      Mechanical Engineering Department, Zhejiang University, Hangzhou, Zhejiang, China
  • Introduction

    The issue will focus on mechanical engineering and application on semiconductor and green energy. With the development of AI and clean energy, higher requirement of mechanical devices are needed to fit with smaller but smarter silicon chips. Hope the issue can help journal have more attention from both academic and industrial readers.
    Aims and Scope:
    1. Mechanical design for silicon chips
    2. Mechanical design and challenges for next generation devices
    3. AI and clean energy trend and requirement for mechanical engineering

  • Guidelines for Submission

    Manuscripts can be submitted until the expiry of the deadline. Submissions must be previously unpublished and may not be under consideration elsewhere.

    Papers should be formatted according to the guidelines for authors (see: http://www.ijmea.org/submission). By submitting your manuscripts to the special issue, you are acknowledging that you accept the rules established for publication of manuscripts, including agreement to pay the Article Processing Charges for the manuscripts. Manuscripts should be submitted electronically through the online manuscript submission system at http://www.sciencepublishinggroup.com/login. All papers will be peer-reviewed. Accepted papers will be published continuously in the journal and will be listed together on the special issue website.

  • Published Papers

    The special issue currently is open for paper submission. Potential authors are humbly requested to submit an electronic copy of their complete manuscript by clicking here.

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